The Chips Joint Undertaking (Chips JU) has adopted an amendment to its Multiannual Work Programme (MAWP) for 2023-2027, introducing significant updates to its strategic initiatives for 2025.
Key Updates:
Electronic Components and Systems Research and Innovation (ECS R&I) calls (Appendix 5 of the MAWP)
- HORIZON-JU-Chips-2025-1-IA: Global Innovation Action (IA)
- HORIZON-Chips-2025-IA HIA: Heterogeneous integration for high-performance automotive computing.
- HORIZON-JU-Chips-2025-IA FT1: RISC-V Automotive Hardware Platform
- HORIZON-Chips-2025-IA FT2: AI-assisted Methods and Tools for Software-Defined Vehicle Engineering Automation
- HORIZON-Chips-2025-RIA: Global Research and Innovation Actions (RIA) targeting the development of next-generation semiconductor components and systems, including neuromorphic computing and heterogeneous integration.
- HORIZON-Chips-2025-CSA: Boosting R&I cooperation between EU and Japan on semiconductors
Funding to help start-ups take advantage of the EU’s new silicon chip design platform dominates this year’s calls from the Chips joint undertaking (JU), a partnership formed in 2023 to implement the EU Chips Act. More than half of the budget assigned to Chips Act priorities in the 2025 calls will support work relating to the platform.
The aim of the Chips Act is to double the EU’s share of the global semiconductor market to 20% by 2030. Key to that will be supporting the development of fabless chip makers, which design semiconductors but outsource their fabrication. Fabless companies make up 50% of global integrated circuit revenues, but Europe’s share of this market is less than 1%.
https://www.chips-ju.europa.eu/News-detail/?id=0a2c827c-3ecf-ef11-b8e8-6045bde08093