- €1 billion EIB loan will help fuel NXP’s research, development, and innovation (RDI) efforts in Austria, France, Germany, The Netherlands and Romania
- Loan will accelerate NXP’s RDI aimed at various end markets including automotive, Industrial, and Internet of Things (IoT)
- Supporting critical EU technology is a key EIB priority as outlined in its strategic roadmap and furthers EIB’s commitment to the EU Chips Act
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that it has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investments across its broad portfolio of semiconductor solutions. The €1 billion loan facility carries an approximate interest rate of 4.75 percent when drawn in dollar denominated tranches, under the current market conditions and has a duration of six years. The financing will support NXP’s research and development efforts in several EU Member States, implemented in its facilities in Austria, France, Germany, the Netherlands and Romania for the period up to 2026.